Wandtec Optronics , delivering AI infrastructure cabling with lower power and better performance

Empowered by the visionary packaging library and processing techniques based design automation flow, Wandtec pioneers in the software-defined 3D cabling manufacturing services for 56Gbps+ infrastructure where the integration of cable, connector and PCBA is critical. Wandtec also integrates artificial intelligence (AI) manufacturing technologies for the high-speed cable/connector/PCB interconnects. The software-defined design-to-manufacturing flow enables Wandtec to deliver new interconnect solutions to customers from concepts to production as little as two months.

By delivering the most advanced low power, low latency and bending insensitive infrastructure passive and active copper cabling, Wandtec helps the industry accelerating the AI infrastructure and datacenter builds with higher than expected reliable cabling solutions.

Product offerings:
* 10G-40G Direct Attached Cable – 28AWG to support 7m passvie, the world’s thinnest cable;
* 25G-100G Direct Attached Cable and Active Direct Attached Cable up to 10m;
50G-1.6Tbps DAC and ADAC in form factor of QSFPDD/OSFP/SFPDD/DSFP/QSFP56/SFP56, the world’s only complete solution provider in the market as of 2021. Supporting native OEM EEPROM and MSA; Support longest reach in the world up to 10m at less than 30% the cost of optical transceiver/active optical cable solutions with benefits in low latency, low power, and high-temp reliability.
* 50G-400G Active Optical Cable based on low latency, low power driver solutions.
* 800G DAC in OSFP/QSFPDD form factors up to 2m passive and 5m active.
* PCIe CEM-to-Any riser cable series for PCIe Gen5/Gen6: the ultimate solutions for storage, PCIe add-in cards, PCIe accessaries, AI servers. Interface includes QSFP/QSFPDD/OSFP/SFF8654/SFF8643/TA1002/TA1020/GenZ etc.
* Custom over-the-board high-speed cable interconnects for 20Gbps+